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          No Items SPEC
          1 Trace Width/Space 35μm /35μm
          2 Trace Width Tolerance ±10%
          3 Distance between Pad and Conductor 0.075mm
          4 Distance between Board Edge and Conductor 0.15mm
          5 Min. Pad Size 0.3*0.3mm
          6 PTH Pad Size 0.25mm
          7 Min. PTH Aperture 0.05mm
          8 Registration of Silk-Screen ±0.075mm
          9 Tolerance of External Dimension ±0.05mm
          10 Tolerance of Aperture ±0.015mm
          11 Registration of Hole ±0.025mm
          12 Thickness of Ni Plating 1μm-5μm
          13 Thickness of Au Plating 0.05μm-0.2μm 
          14 Maximum Layer 8 Layers



          項目 量產能力
          Chip器件 可加工最小尺寸電阻、電容電感 0201
          SMT加工直通率 99.95%
          連接器 可加工最小Pitch 連接器 0.4mm
          SMT加工直通率 99.80%
          BGA 可加工最小Pitch BGA器件 0.4mm
          SMT加工直通率 99.80%
          QFN 可加工最小Pitch QFN器件 0.4mm
          SMT加工直通率 99.80%
          LED LED燈貼裝角度精度 ±1°
          SMT加工直通率 99.90%
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